AI Technology Introduces Second Generation of Patented Cool-Pad™ Conformal Pad for LED Lighting

Cool-Pad™ CPR7154 is semi-tacky on both sides for optimum thermal transfer performance. Cool-Pad™ CPR7154 has high thermal conductivity and low Tg characteristics that impose minimum thermal stress on bonded parts during thermal cycling or shock testing. While Cool-Pad™ has some intrinsic tack strength, it is not designed for bonding. A mechanical fastener must be used to provide assembly integrity.

A mechanical fastener of 5 psi or more is recommended to provide intimate contact between the Cool-Pad™ and the interfacing surface. Because Cool-Pad™ is compressible, it will fill in uneven height differentials and warps between the mating surfaces. The ultimate performance of Cool-Pad™ is achieved after the first cycle of melt-flow phase-change at 45°C or automatically when the device heats up during operation or with externally applied heat if the device is not anticipated to reach 45°C .

Cool-Pad™ CPR7154 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridgelux, etc. Of course, the same phase-change pad works great for CPU and GPU in Xbox360, Play Station, and other game consoles.  Cool-Pad™ CPR7154 is also ideal for CPU modules and graphic card interfaces in laptops and desktops such as Asus, Samsung, BenQ, Foxconn and other OEM.

For more product information visit: http://ift.tt/1hX7RIf
For an application analysis: http://ift.tt/1hX7RIj

About AI Technology, Inc. (AIT):
Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology has been one of the leading forces in development and patented applications of advanced materials and adhesive solutions for electronic interconnection and packaging. AI Technology now has one of the highest reliability adhesives and underfills for die bonding for the largest dies, stack-chip packaging with dicing die-attach film (DDAF), flip-chip bonding and underfilling and high temperature die bonding for single and multiple-chip modules for applications beyond 230°C. The company continues to provide the best adhesive solution for component and substrate bonding for both military and commercial applications.
AIT’s thermal interface material solutions, including our patented phase-change thermal pads, thermal greases and gels and thermal adhesives have set many bench marks of performance and reliability for power semiconductors, modules, computers and communication electronics.

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