Dies produced on big 6″ wafers allow a high yield, with significantly lower production costs compared to the use of sapphire or silicon carbide as a substrate. Additionally Plessey has the know-how to manufacture this silicon substrate as paper-thin layer around 2.5μm thickness. Difficulties such as different thermal coefficients or crystallographic differences between the two materials were perfected in production and prevent wafer bowing or cracking.
By a far cheaper manufacturing process and the possibility of offering the chips in sizes 180×180 – 3000×3000μm, as well as integrated packages of 1005 – 5630 available in blue and white color, we see obvious advantages over the competition.
The COmponent DIstributing COmpany, better known as CODICO, is a name that stands for the design-in distribution of high-quality active and passive electronic components and interconnect systems.
CODICO is an independent, privately owned company with headquarters in Perchtoldsdorf, Austria, on the southern outskirts of Vienna. In addition to 17 sales offices in Germany, the international CODICO team consists of one office each in Denmark, Italy, France, United Kingdom and eight partner companies in Central and Eastern Europe. Backed by a high level of technical expertise, we place a key focus on design-in services for our customers. CODICO’s core business thus consists of providing technical support from the initial development phase through to the end product, along with the sale of only high-quality electronic components.
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