The EVG720 UV-NIL system—EVG’s most advanced dedicated NIL system—utilizes a next-generation UV-NIL process designed specifically to address the needs of high-volume manufacturing (HVM). It provides an unmatched combination of high throughput, ease of use and high resolution—enabling volume manufacturing of nanoscale structures at the lowest CoO. EVG’s UV-NIL solutions, including the EVG720 system, are designed to work with a wide variety of resist materials. This open materials platform approach provides customers with a high degree of flexibility and process customization.
In addition, the EVG720 has an integrated stamp replication capability, which minimizes tool footprint and avoids increased capital equipment costs associated with stand-alone replication systems. EVG’s soft working stamps have optimized releasing properties that extend the life of the stamp and enable ideal imprint results on both flat and rough substrates. Traditional stamps wear down quickly or require additional surface treatment after each imprint and result in increased defectivity on the substrate that leads to yield loss, as well as increased costs from continuous replacement.
“EV Group continues to extend its leadership in low-cost, high-throughput and reliable NIL solutions with our new EVG720 platform, which is built on nearly 20 years of experience with more than 100 UV-based imprint lithography systems in the field,” stated Gerald Kreindl, business development manager at EV Group. “We recognize that a one-size-fits-all approach to NIL can’t address every customer’s unique manufacturing requirements, which is why EV Group has created a complete NIL solutions portfolio that encompasses all widely accepted imprint techniques—UV-NIL, hot embossing, micro contact printing, step-and-repeat, full-field, and roll-to-roll imprint. In addition, we are continuously working to improve the imprint lithography infrastructure by collaborating with companies and research organizations throughout the imprint lithography supply chain.”
Media and analysts interested in learning more about EVG’s latest developments in nanoimprint lithography and other processing solutions are invited to visit the company’s booth #4B-207 in the Makuhari Messe International Convention Complex in Chiba, Japan at the SEMICON Japan show December 4-6 as well as attend the company’s presentations during the show’s technical program. EVG will present “EVG’s HVM solution updates for automotive and smart phone applications,” during the Exhibitor Seminar on Wednesday, December 4 from 2:30 – 3:20 p.m. at the International Conference Halls, Room 103. In addition, Masaya Kawano, head of technology Japan / applications engineer for the Technology Division of EV Group Japan, will present “Latest wafer bonders which drive 3D-IC technology” at the Proposals to the Assembly Technologies to Drive 3D-IC session on Friday, December 6 from 1:45 – 2:00 p.m. at the TechSTAGE West, Hall 1.
About EV Group (EVG):
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors and power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com
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