New 3M LED Chip Packaging Substrate Provides Economical Substitute for Ceramic

3M Electronics Materials Solutions Division in Austin, Texas,
launched its new LED Chip Packaging Substrate that provides a
cost-effective alternative to ceramic substrates. The company says
that the new substrate, which combines copper and polyimide, 
can meet the thermal and electrical performance that high-power LED
chips need at a competitive price compared to ceramic substrates.
The …

Category: inframaterialsubstrate

via Solid State Lighting Net:

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