The traditional tungsten incandescent light bulb has been phased out in favour of LED technology providing the most reliable and efficient lighting solutions. Plessey’s Chip-On-Board LED filaments create the same amount of light, while consuming less energy and offering longer life and utilize its patented MaGIC™ GaN-on-Silicon technology.
The LED filaments are designed with unique terminations so that they can be handled and spot welded by existing high volume fully automated glass lamp manufacturing lines. In addition to that, Plessey has incorporated a bespoke approach to controlling the current and Vf of the filaments when the filaments are driven in a bridge configuration.
Plessey’s CTO, Dr. Keith Strickland, said, “We have taken our existing Chip-Scale-Packaging technology, also used for our dotLEDs, into a revised format for the filament. Not only do we have an improvement in terms of manufacturability with GaN-on-Silicon and enhanced the power control for filament resistors, but Plessey will also be incorporating other active and passive electronic components for Chip-On-Board and Chip-Scale-Packaging solutions in next generation of filaments. Thermal performance and customisation are key to our filament product portfolio, and Plessey remains committed to bring to market unique LED products through our integrated approach to solid state lighting applications.”
Plessey is a leading expert in the manufacture of semiconductor products used in sensing, measurement and controls applications, and is now at the forefront of the Solid State Lighting revolution. Its MaGIC™ (Manufactured on GaN-on-Si I/C) LED technology has won numerous awards for its innovation and ability to cut the cost of LED lighting by using standard silicon manufacturing techniques. By using its understanding of electronics and expertise in micro-electronic product design and manufacture, Plessey is radically enhancing the human experience with micro-electronics solutions such that people achieve more than they thought possible.
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