The library is based on X-FAB’s cost-optimized XU035 technology – a 0.35 micrometer modular 700V ultra-high-voltage non-epi CMOS process with single 5V gate oxide; it is engineered for applications requiring an integrated power and start-up device solution. The XU035 process offers low specific On-resistance 700V power devices and the lowest mask count in the foundry industry, enabling the most cost-effective solutions for consumer applications. This technology is ideal for energy conservation applications such as AC LED lighting, chargers with no-load power consumption and other power conversion and control applications.
X-FAB Silicon Foundries, the leading analog/mixed-signal foundry, will exhibit its high-performance power management solutions in 0.18 and 0.35 micrometer technologies at the Applied Power Electronics (APEC) 2014 Conference and Exposition in Fort Worth, Texas, next week. These solutions include its ultra-high-voltage CMOS process and a new analog cell library available in its XU035 process that helps engineers design monolithic AC/DC converters. APEC is the premier event in Applied Power Electronics™; it focuses on the practical and applied aspects of the power electronics business.
X-FAB steps beyond logic and memory scaling to deliver “More than Moore” value for customers. This is also true for this latest approach for LED driver and supply electronics. X-FAB integrates technology features that interact with the analog world, and provides a comprehensive design ecosystem. It includes services and tools for developing diversified power/HV, MEMS, opto and analog products; a 24-hour technical hotline service; a portfolio of technically mature, extensive libraries and IP; a broad spectrum of primitive devices; and flexible prototyping options – all backed by X-FAB’s 20 years of solid analog/mixed-signal foundry expertise.
X-FAB is the leading analog/mixed-signal foundry group manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB maintains wafer production facilities in Erfurt and Dresden (Germany); Lubbock, Texas (US); and Kuching, Sarawak (Malaysia); and employs approximately 2,400 people worldwide. Wafers are manufactured based on advanced modular CMOS and BiCMOS processes with technologies ranging from 1.0 to 0.13 micrometers, for applications primarily in the automotive, communications, consumer and industrial sectors. For more information, please visit www.xfab.com.
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